tions. It can be integrated with lasers from the
JK fiber and Nd: YAG ranges. It offers a variety
of customizable options, including linear and
rotary axes, process tools and scan heads, and
proprietary software that closely couples motion
and laser control. Besides its processing advantages, the system has an ergonomic design and
an integrated Class I safety enclosure with a
viewing panel, meaning that it can be safely
and easily installed into most industrial premises.
GSI Group Laser Div.
sales.laserdivision@gsig.com
Hot Water Debondable Epoxy
To simplify silicone ingot bonding and protect
against wafer breakage, Henkel Corp. has
introduced Loctite 3382, a hot water-debond-
able epoxy adhesive that provides good bond
strength to solar silicon and the glass and metal
mounting substrates used during the ingot saw-
ing process. It replaces traditional epoxies that
require caustic acids for debonding. The adhe-
sive breaks down easily upon exposure to hot
water, eliminating corrosive debonding and
minimizing the silicon waste that occurs during
the wafer cleaning process. The two-part epoxy
is pink when cured, so it is easy to distinguish
from the silicon ingot and the metal and glass
mounting substrates during visual inspection. It
emits no caustic odor, will not corrode equip-
ment and is fully compatible with current wafer
cleaning solutions and processes.
Henkel Corp.
mark.ziehm@henkel.com
